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| Silicon PIN Chips RoHS Compliant Features V15 Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated CERMACHIP(R) Oxide Passivated Planar Chips Voltage Ratings to 3000V Fast Switching Speed Low Loss High Isolation RoHS Compliant Absolute Maximum Ratings1 TAMB = +25C (Unless otherwise specified) Parameter Forward Current (IF) Reverse Voltage (VR) Absolute Maximum Value Per P/N Rs vs. I Graph Per Specification Table Power Dissipation (W) (175C -TplateC ) / Theta Operating Temperature Storage Temperature -55C to +175C -55C to +200C +175C +320C for 10 seconds may cause permanent Description M/A-COM offers a comprehensive line of low capacitance, planar and mesa, silicon PIN diode chips which use ceramic glass and silicon nitride passivation technology. The Silicon PIN series of devices cover a broad spectrum of performance requirements for control circuit applications. They are available in several choices of I-region lengths and have been optimally designed to minimize parametric trade offs when considering low capacitance, low series resistance, and high breakdown voltages. Their small size and low parasitics, make them an ideal choice for broadband, high frequency, micro-strip hybrid assemblies. The attenuator line of PIN diode chips are a planar or mesa construction and because of their thicker I-regions and predictable Rs vs. I characteristics, they are well suited for low distortion attenuator and switch circuits. Incorporated in the chip's construction is M/A-COM's, time proven, hard glass, CERMACHIP(R) . The hard glass passivation completely encapsulates the entire PIN junction area resulting in a hermetically sealed chip which has been qualified in many military applications. These CERMACHIP(R) diodes are available in a wide variety of voltage ratings, up to 3,000 volts and are capable of controlling kilowatts of power. Many of M/A-COM's silicon PIN diode chips are also available in several different package styles. Please consult the "Packaged PIN Diode Datasheet" for case style availability and specifications. The datasheet is located on the M/A-COM website at : www.macomtech.com/DataSheets/packagedpindiodes.pdf Junction Temperature Mounting Temperature 1. Exceeding these limits damage to the chip Anode Full Area Cathode M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Silicon PIN Chips RoHS Compliant Low Capacitance PIN Specification @ TAMB = +25C Nominal Characteristics Max. Max. Max. Rev. Cap. Series Res. Carrier 1 3 1 MHz 500 MHz Lifetime Volt. Part Number MA4P161-134 MA4P203-134 MADP-000165-01340W MADP-000135-01340W V15 Reverse Recovery I Region 2 Time Length Theta TRR S 15 25 20 44 Anode Dia. 0.5 mils 3.5 3.1 1.8 3.1 Chip Size 2 mils 13X13 13X13 13X13 13x13 Chip Thk. 1 mils 6 6 10 10 VR <10 A Cj @ -10 V RS @ 10 mA VDC pF 100 100 200 200 0.10 0.15 0.06 0.15 1.50 1.50 2.50 1.20 TL S 150 150 200 440 m 13 13 19 19 C/W 65 75 150 35 Notes: 1. Nominal carrier life time,TL , specified at IF = + 10mA , IREV = - 6mA. 2. Nominal reverse recovery time specified at IF = + 20mA , IREV = - 200mA. 3. VR ( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10A. Attenuator PIN Specification @ TAMB = +25C Nominal Characteristics Max. Rev. 2 Volt. Max. Series Res. 100MHz Carrier 1 Lifetime TL S 2 1 Max. Cap. 1MHz Series Res. 100MHz Series Res. 100MHz I Region Length Theta mils 4 2 Anode Dia. 0.5 mils 7.5 X7.5 7.5 3 Chip Size 2 mils 19X19 13X13 Chip Thk. 1 mils 7 7 Part Number VR <10 A Cj @ -100 V RS @ 10 mA VDC pF MA47416-132 MA47418-134 200 200 0.15 0.15 6 3 RS @ 1 mA RS @ 10 A 30 15 2000 500 C/W 30 25 Notes: 1. Nominal carrier life time,TL, specified at IF = + 10mA, IREV = - 6mA. 2. VR ( Reverse Voltage ) is sourced and the resultant reverse leakage current, IR, is measured to be <10A. 3. Anode top contact is square. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Silicon PIN Chips RoHS Compliant CERMACHIP(R) PIN Chips Specification @ TAMB = +25C Unless Unless otherwise noted otherwise noted Max. Rev. 5 Volt. Part Number MA4P303-134 MA4P404-132 MA4P504-132 MA4P505-131 MA4P506-131 MADP-000488-13740W MA4P604-131 MA4P606-131 MA4P607-212 MA4PK2000-223 1 1 V15 Nominal Characteristics 4 Max. Cap. 1 MHz CJ @ -100 V pF 0.15 @ 10 V 0.20 @ 50 V 0.20 0.35 0.70 0.16 @ 50V 0.30 0.60 1.30 2.40 2.90 Max. Series Res. Carrier 100 MHz RS @ 100 mA 1.5 @ 50 mA 2 2 Lifetime S 0.3 0.6 1 2 3 4 3 4 5 I Region Length Theta m 20 30 50 50 50 140 90 90 127 230 350 Anode Dia. Chip size Chip Thk. 1 mil 10.0 7.0 12.0 11.0 12.0 13.5 13.5 14.0 18.5 21.0 28.0 VR < 10 A VDC 200 250 500 500 500 900 1000 1000 1000 2000 3000 C/W 30 20 15 14 11 45 10 8 4 2 1.5 0.5 mil 2 mils 3.0 6.8 6.8 13.0 15.8 12.2 17.0 21.0 37.0 72.0 85.0 13X13 20X20 20X20 27X27 27X27 23X23 27X27 32X32 62X62 111X111 172X172 0.70 @ 50 mA 0.60 0.45 0.30 1.6 @ 50 mA 1.00 0.70 0.40 0.20 @ 500 mA 0.25 @ 500 mA 3 3 10 40 MA4PK3000-1252 Notes: 1. Upon completion of installation into a circuit, the chip must be covered with a dielectric conformal (R) coating such as SYLGARD 539 to prevent voltage arcing. 2. Test Frequency = 500 MHz. 3. Test Frequency = 4 MHz. 4. Nominal carrier lifetime, TL, specified at IF = + 10 mA , IREV = - 6 mA. 5. Minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, IREV, is measured to be < 10 A. Anode M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Silicon PIN Chips RoHS Compliant Typical Series Resistance vs. Forward Current Performance V15 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Silicon PIN Chips RoHS Compliant MA4PK2000 & MA4PK3000 (2kV & 3kV) Chips V15 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Silicon PIN Chips RoHS Compliant V15 Die Handling and Mounting Information Handling: All semiconductor chips should be handled with care to avoid damage or contamination from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickup is strongly recommended for the handling and placing of individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS compliant solders or electrically conductive silver epoxy. The metal RF and D.C. ground plane mounting surface must be free of contamination and should have a surface flatness of < 0.002". Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is recommended. When hot forming gas (95%N/5%H) is applied, the work area temperature should be approximately 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 10 seconds. Eutectic Die Attachment Using Reflow Oven: Refer to pages 5-7 of Application Note M538, "Surface Mounting Instructions" at www.macom.com for recommended time-temperature profile. Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive, silver epoxy, approximately 1-2 mils in thickness, should be used to minimize ohmic and thermal resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement to ensure full area coverage. Cure conductive epoxy per manufacturer's schedule. Typically 150C for 1 hour. Wire and Ribbon Bonding: The die anode bond pads have a Ti-Pt-Au metallization scheme, with a final gold thickness of 1.0 micron. Thermo-compression or thermo-sonic wedge bonding of either gold wire or ribbon is recommended. A bonder heat stage temperature setting of 200oC, tool tip temperature of 150C and a force of 18 to 50 grams is suggested. Ultrasonic energy may also be used but should be adjusted to the minimum amplitude required to achieve an acceptable bond. Excessive energy may cause the anode metallization to separate from the chip. Automatic ball or wedge bonding may also be used. For more detailed handling and assembly instructions, see Application Note M541, "Bonding and Handling Procedures for Chip Diode Devices" at www.macom.com. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. |
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